Asrock Rack 2OU3N-SIENA 2OU Chassis
Maximize your data center efficiency with the Asrock Rack 2OU3N-SIENA 2OU chassis, a powerful and versatile solution designed for high-performance computing. This chassis features a three-bay shelf for ORv3, delivering exceptional processing power with support for up to 1600W per sled from a 50/48V busbar.
Unleash Next-Generation Memory Performance
Equipped with 10 DIMM slots (2DPC/1DPC) per sled, the 2OU3N-SIENA supports the latest DDR5 RDIMM technology. This allows for lightning-fast data access and processing speeds, making it ideal for demanding workloads such as artificial intelligence, machine learning, and data analytics.
High-Speed Storage for Critical Applications
The chassis provides ample storage capacity with four hot-swap 2.5" NVMe (PCIe4.0 x4) drive bays per sled. These high-speed drives deliver exceptional read and write speeds, ensuring rapid data access and application responsiveness. The hot-swap functionality enables seamless drive replacements without system downtime, maximizing uptime and productivity.
Features:
- 2OU chassis with three-bay shelf for ORv3
- 1600W per sled from 50/48V busbar
- 10 DIMM slots (2DPC/1DPC) per sled
- Support for DDR5 RDIMM per sled
- 4 Hot-swap 2.5" NVMe (PCIe4.0 x4) drive bays per sled
Specifications
System | |
Form Factor | 2OU Rackmount, ORv3 |
Dimensions | 537 x 803 x 93mm (21.1'' x 31.6'' x 3.7'', Shelf Dimensions) |
Support MB | SIENAD10HM3 |
Front Panel | |
Buttons | Power, UID button w/ LED, reset button |
LEDs | Power, system fault LED |
I/O Ports | 1 Mini-DisplayPort (VGA)*, 2 Type-A (USB3.2 Gen1) *Need to bundle ASRock Rack special cable for VGA |
IPMI LAN | 1 dedicated IPMI |
Rear Panel | |
Backplane power connector | 1 IT Gear connector for ORv3 50/48V busbar |
External Drive Bay / Storage | |
Front Side Drive Bay | 4 Hot-swap 2.5" NVMe (PCIe4.0 x4) drive bays per sled |
Internal Side | 2 M-key (PCIe5.0 x4 or SATA 6Gb/s), supports 22110/2280 form factor per sled |
Power Supply | |
Type | Centralized 50/48V busbar to 1OU3N_PDB_V3 |
Output Watts | 1600W |
System Fan | |
Fan | 2 system fans (80 x 38 mm) per sled |
Processor System | |
CPU | Supports AMD EPYC™ 8004 series processors |
Socket | Single Socket SP6 (LGA 4844) |
Chipset | System on Chip |
System Memory | |
Supported DIMM Quantity | 10 DIMM slots (2DPC/1DPC) |
Supported Type | Supports DDR5 288-pin RDIMM |
Max. Capacity per DIMM | 96GB (2Rx4) |
Max. DIMM Frequency | 4800 MHz |
Voltage | 1.1V |
PCIe Expansion Slots (SLOT7 close to CPU) | |
PCIe x 16 | 1 HHHL PCIe5.0 x16 per sled |
Ethernet | |
OCP slot | 1 OCP NIC 3.0 (PCIe5.0 x16) per sled |
Server Management | |
BMC Controller | ASPEED AST2600 |
IPMI Dedicated GLAN | 1 Realtek RTL8211F for dedicated management GLAN |
System BIOS | |
BIOS Type | AMI UEFI BIOS; 256 Mb SPI Flash ROM |
BIOS Features | ASRock Rack Instant Flash, ACPI 6.4 and above compliance wake up events, SMBIOS 3.5.0 and above, Plug and Play(PnP) |
Hardware Monitor | |
Temperature | CPU, MB, Card side, TR1 Temperature sensing |
Fan | Fan Tachometer Quiet Fan (Allow Chassis Fan Speed Auto-Adjust by CPU Temperature) Fan Multi-Speed Control |
Voltage | VDDCR_CPU, VDDCR_SOC, VDDIO, VDD_18_S5, VDD_33_S5, VDD_11_S3, +3V, +5V, +12V, +BAT, +1V8SB, 3VSB, 5VSB |
Environment | |
Temperature | Operation temperature: 10°C ~ 35°C / Non operation temperature: -40°C ~ 70°C |
Humidity | Non operation humidity: 20% ~ 90% ( Non condensing) |
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