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Broadcom 16nm Octal 56-Gb/s PAM-4 Duplex Backplane PHY - BCM81330

Product code: UK-BRC-BCM81330
Condition: New
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Broadcom 16nm Octal 56-Gb/s PAM-4 Duplex Backplane PHY - BCM81330

Broadcom 16nm Octal 56-Gb/s PAM-4 Duplex Backplane PHY - BCM81330

Broadcom 16nm Octal 56-Gb/s PAM-4 Duplex Backplane PHY - BCM81330

The Broadcom BCM81330 is a single-chip, low-power Pulse Amplitude Modulation (PAM-4) PHY. It integrates equalizer and retimer functions, supporting eight full-duplex, 56-Gb/s ports for backplane applications. In the octal 56-Gb/s mode, the BCM81330 supports duplex 8× 56-Gb/s PAM-4 to 8× 56-Gb/s PAM-4 to drive Long Reach (LR) (30 dB) backplane in fabric/line cards.
 
The BCM81330 also supports multiple standard/line rate, including both PAM-4 and Non Return-to-Zero (NRZ). The BCM81330 provides forward error corrections (FECs) support. On-chip clock synthesis is performed by a single, low-cost 156.25 MHz reference clock via high-frequency, low-jitter phase-locked loops (PLLs). Individual clock recovery is performed on the device by synchronizing directly to the respective incoming data streams.
 
The BCM81330 is designed in 16-nm CMOS technology to provide a low-power solution with integrated AC-coupling capacitors. The BCM81330 is available in a 19-mm × 19-mm, 1.0-mm pitch, 324-ball BGA, RoHS-compliant package.

Features

• Line-side interface supports backplane channels (30-dB insertion loss) with high-performance receiver equalization
• Host-side interface compliant to the CEI-28G/56G-LR specifications supporting LR 30-dB channels
• Supports FEC, bypassable
• Supports multiple standard/line rates in both PAM-4 and NRZ
• Continuous auto-adaptive equalization
• Designed with low-power, 16-nm CMOS technology
• Line-side and host-side loopbacks
• Advanced diagnostics, including eye monitoring feature with pseudorandom bit sequence (PRBS) generator and checker
• Single, low-cost 156.25-MHz reference clock
• Interoperability with Broadcom ASIC and Merchant Switch Silicon
• 19-mm × 19-mm, 1.0-mm pitch, 324-ball BGA, RoHS-compliant package

Applications

  • High density switch
  • 10G, 25G, 40G, 50G, 100G, 200G, and 400G line-card backplane applications.

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